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发帖时间:2021-06-15 01:14:13

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Using FPGAs to prove a new process technology is a first for IBM. SRAMs were once favored because they are based on an array of redundant cell structures, which helps in identifying defects. PowerPC microprocessors have also been used to spearhead process development because they fetch a high price and usually need the latest process technology to stay competitive in performance.

FPGAs have many of the same attributes, but the companies were able to go a step further. Xilinx developed a variant of an FPGA structure, called a defect monitor vehicle, along with software tools to help IBM keep better track of defect density.

varistor schematic symbol

You can detect any defect down to a single bit failure at every metal level. For an SRAM it takes three days to a week with repeated bit maps. For microprocessors it's a matter of weeks. In this structure it takes a matter of hours,” Davari said.

Xilinx's FPGAs, which make heavy use of interconnect, should also benefit from IBM's use of low-k dielectric materials around the metal lines, considered a key ingredient to enhancing chip performance, said Richard Sevcik, Xilinx's senior vice president of FPGA products.

Sevcik said Xilinx has been working with IBM for the past six months on silicon-on-insulator technology, adding that it is very likely” that the company will incorporate SOI into future FPGAs manufactured at the 90-nm node.

varistor schematic symbol

Bel Fuse Inc., Jersey City, N.J., announced today that it has entered into a definitive agreement to acquire the assets of the passive components business from Insilco Technologies, Inc. for approximately $35 million in cash and the assumption of certain liabilities.

Included in the proposed acquisition are the assets of Insilco Technologies subsidiaries Stewart Connector Systems, Inc., InNet Technologies, Inc., and Signal Transformer Co., Inc. Insilco's passive components business sells transformers and connectors, among other products.

varistor schematic symbol

Insilco has disclosed in its 10-Q for the period ended September 2002, that net sales for its passive components segment during the nine month period ended September 27, 2002 were $52.6 million.

Insilco Technologies, Inc. is the primary operating subsidiary of Insilco Holding Co. (OTC). To facilitate this and other, unrelated transactions, Insilco Holding Co. will file voluntary petitions under Chapter 11 of the U.S. Bankruptcy Code in the United States Bankruptcy Court for the District of Delaware. A competitive bidding process may be conducted in the bankruptcy proceedings. If Bel is the successful bidder, the transaction is expected to close in the first quarter of 2003, subject to customary closing conditions.

Is this buildup, the researchers ask, another semiconductor industry disaster in the making?”

Taiwanese chip makers have 11 new 300-mm wafer fabs under way or on the drawing boards, Future Horizons notes in its December Semiconductor Industry Update Newsletter, attributing the figures to Gordon Shen, president of the Taiwan Semiconductor Industry Association.

Future Horizons notes that 11 12-inch wafer fabs are roughly equivalent to at least 25 advanced 200-mm wafer fabs, or a MOS capacity increment of some 200,000 eight-inch equivalent wafer starts per week. The market researcher says mainland China plans to build 25 advanced fabs by 2005 in its bid to build a national chip industry,” creating a similar level of added capacity.

Taiwan's capital expenditure as a percent of revenues ran at 66 percent in 2000, and 55 percent in 2001, three times the normal industry average,” the newsletter said. Mainland China's figures are an awful lot higher. It rather begs the two obvious questions: Where is all the necessary funding going to come from and how is it ever going to be paid back?”

Peter Clarke writes for Semiconductor Business News, an EE Times Network Web site.

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