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SMBJ26A-M3/5B

发帖时间:2021-06-15 03:08:55

The network is opening up to a lot more server functionality,” said Shantanu Gupta, director of marketing for Intel's telecom platforms.

McCartney has served as senior vice president/director of the $1 billion IP&E Product Business Group, Avnet Electronics Marketing/Americas, for the last three years. Prior to that he was vice president/director of Avnet EM/Americas' Passive & Electromechanical Product Business Unit.

Having begun his career in distribution with Powell Electronics in the early 1980s, he later joined Time Electronics, where he spent 14 years and advanced his career through positions in sales, branch and regional management. He was named vice president/area director of Time in 1996.

SMBJ26A-M3/5B

Olson will depart Avnet in an executive role on March 31, and is slated to join Avnet Inc.'s management board.

The Arrow-2xGE physical layer device has been released to map Gigabit Ethernet frames over Sonet links. The IC supports 2 Gigabit Ethernet channels and independently maps each of them into an STS-48/STM-16 channelized payload, using the virtual concatenation and generic frame procedure (GFP) standards. Specifically aimed at MAN applications, the device was developed using a 3.3-/1.8-V CMOS process and draws less than 2 W/port power during operation.

PMC-Sierra, www.pmc-sierra.com

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TOKYO — Advantest Corp. has introduced a new dynamic test handler capable of doubling the throughput of high-end logic and system-on-chip testing by performing tests on up to eight devices simultaneously. The maximum throughput of 6,000 devices per hour is twice the capacity of the system's predecessor, Advantest said.

The M4541AD employs a new device-handling mechanism and optimizes the motion efficiency of the handler's pickup arm, which helps cut test costs by providing shorter index times and maximizing throughput, said the company, which formally rolled out the new handlers at last week's Semicon Japan trade show.

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The handler said connects with SoC automatic test systems to support fast manufacturing-line testing, and it can be used together with memory ATE systems, said the Japanese tester supplier. This capability provides a cost-effective solution to distributing the burden of lengthy SoC testing between both system-on-chip and memory testers to optimize efficiency–a practice known as two-pass testing,” Advantest said.

Advantest said it has also addressed cost issues by reducing the size of the system and increasing the energy efficiency compared to previous models. A heat plate enables testing of chip performance under high temperatures. A new architecture for device interfaces incorporates a new layout unit, which forms an additional layer between the handler and Advantest's existing device interfaces. This makes it possible to adjust the system for different socket arrangements and contact pitches without additional investments for specific IC package configurations, said Advantest.

Schumacher: It's difficult for me to understand the rationale behind these discussions. It doesn't fit into Micron's consolidation model to gain access to cheap capital, such as acquiring the Texas Instruments [DRAM] fabs. I don't see how it would work if Micron took over the Hynix fabs. I think the likelihood of this happening is somewhat low. [The Korean government] isn't going to allow Micron to close any of the inefficient Hynix fabs. My imagination isn't big enough to know how Micron could effectively upgrade these fabs.

EBN: Is Micron interested in adding Hynix's DRAM market share to become the world's largest producer?

Schumacher: You can't make the assumption that combining Hynix's roughly 20% market share would end up giving Micron a 40% global share. On the customer side, [DRAM] buyers are not willing to accept one supplier gaining such a dominant market share. And Micron would like to close older [Hynix] fabs if they could, so this lost production wouldn't be added to Micron's market share.

EBN: The Infineon 300- mm-wafer Dresden fab now ramping up production will be joined in the first quarter of 2002 by a second 300mm DRAM fab in Taiwan by the ProMOS joint venture with Mosel Vitelic. Each of these fabs will produce almost two-and-a-half times more DRAM die on a 300mm wafer than equivalent die on today's 200mm wafer. Aren't you concerned the additional capacity will flood an already glutted DRAM market with even more chips, just when supply and demand are starting to come into balance?

Schumacher: The extra die from our 300mm-wafer fabs will only increase Infineon's global market share by two percentage points. That won't have a major impact on the global supply of DRAMs.

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