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CDV30EK750JO3_Datasheet PDF

发帖时间:2021-06-15 01:19:27

The company said its distribution model won't change. AMI typically engages with its ASIC customers directly and will generally take on projects as long as the customer has more in the pipeline.

As many of you know, Agere has a strong systems development background and has been in the WLAN market for the past 10 years. However, about a year ago Agere decided to position themselves as a technology company provider as opposed to an end-product provider. So, the company sold the ORiNOCO wireless line to Proxim last summer and focused on working with original design manufacturer partners like USI to take the Agere chipset technology, reference designs, software drivers, as well as application level support and create new products for the market place. This current announcement is a fulfillment of the company's change in market strategy. Agere now is looking at what's required to bring WLAN to new platforms/applications and to work with ODMs to bring products to market. We'll see very soon if this was a good move by Agere, but it certainly plays to the company's technical strengths.

The reason Agere moved to the ODM model is simply because 802.11b market is an extremely competitive market with more than 50 companies providing some level of chip design. This approach allows Agere to provide a cost-effective solution and get products to market quickly. It also allows Agere to integrate its technology with other technologies like Bluetooth.

CDV30EK750JO3_Datasheet PDF

These modules are designed for integration into consumer hand-held devices communication products that require some form of wireless connectivity. Previously, a customer could achieve this with an add-on card that was purchased through after market or retail channels. It could be a PC card or compact Flash. The module that Agere offers through USI integrates directly onto the system board. In addition to the small form factor of 22 mm x 29 mm (it's about the size of man's wristwatch), it also has an on-board connector that allows the PDA manufacturer to integrate the module directly onto its system board in a normal manufacturing environment before the finished product is shipped to market. Agere says they are enabling a different class of product that needs wireless connectivity but doesn't have it, and offering it in a small form factor, cost-effective module that meets the system requirements including low power operation.

The release says that it can replace the compact Flash card because it is an embedded solution. Instead of having a card that you would insert in the back of a PDA, you would have a solder-less connection that a device maker can plug inside the device. The ODM is also given the option of embedding the Bluetooth WiFi module or the WiFi only module. Both modules have the same form factor and same pin connections ” and that makes it easier for the ODMs. This is a time-to-market aid and design savings for device makers because they don't have to add to their manufacturing process ” all they need to do is insert it.

Agere is providing the WiFi technology, the chipset, the software drivers and the application support to bring this to market. So, who will use this product? One example includes a PDA with wireless connectivity. Presently, you must get a card, but soon it will become a standard feature. Other users include the Smartphone manufacturers and other consumer devices like cameras, printers will integrate it and offer it as a feature for the end customer. Another example could be wireless headphones while you are walking with a Smartphone connected to the Internet and the headset is talking to the phone via Bluetooth. The sampling plan is for the Q3 and production will start in Q4. There is a PC manufacturer who will be using this in a PDA device. So delivery of product is very near.

CDV30EK750JO3_Datasheet PDF

Product Brief

TOKYO — Nikon Corp. has delivered an electron-beam projection lithography tool to Semiconductor Leading Edge Technology Inc. (Selete), a Japanese consortium set up to test semiconductor production equipment. Nikon's NSR-EB1A system was delivered in late June to Selete's clean room in Tsukuba, Japan. The footprint of the prototype system is fairly large, measuring 9 x 9.7 meters. After assembling and tuning the system, Selete plans to begin testing it by November.

CDV30EK750JO3_Datasheet PDF

Electron projection lithography (EPL) is one of several next-generation technologies Nikon is exploring. Selete has strongly backed EPL development since including the technology among its next-generation lithography projects in 2001.

We are going to set up the tool as early as possible and to deliver practical, reliable data,” said Akihiko Morino, president of Selete. That will be the most persuasive way to establish the presence of EPL among next-generation lithography systems.”

All of Broadcom's wireless solutions can be enhanced with its newly announced standards-based Xpress technology, which increases throughput by improving the efficiency of wireless transmissions. Performance gains afforded by Xpress technology are not limited to 802.11g or Broadcom products. Any 802.11 client adapter can receive Xpress technology packets and achieve better throughput. This is especially beneficial in many corporate networks that include equipment from multiple vendors. In homes, the additional bandwidth provided by Xpress will improve performance as consumers add wireless LAN-enabled devices to their home networks, including desktop PCs, printers, handheld devices, and media servers.

Broadcom's AirForce Wireless LAN Product Family

Broadcom's high performance AirForce wireless LAN product line features the greatest breadth and depth in the industry. In addition to transceivers that provide IEEE 802.11g, 802.11b, and dual-band 802.11a/g solutions, Broadcom integrates wireless network processors, communications technologies, and software solutions into reference designs that speed customers' time-to-market.

The AirForce family includes 54g™, the premier technology for 54 Mbits/s wireless LANs in homes, offices, and public hot-spots. Solutions based on 54g™ technology provide the highest throughput and range, and are completely interoperable with the 40 million 802.11b nodes currently in service. Broadcom partners, including Apple, Belkin, Buffalo/MELCO, Cisco/Linksys, Dell, Fujitsu, Gateway, and HP, have implemented 54g™ technology in notebook PCs, client devices, access points, routers, cable modems, DSL modems, and GPRS cellular products. For additional information about products based on Broadcom or 54g™ technology, visit www.broadcom.com or www.54g.org.

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